Our physically foamed TPU sheets are engineered to meet the demanding requirements of Chemical Mechanical Planarization (CMP) processes in the semiconductor industry. With a fine, uniform cellular structure and customizable compression properties, these foamed sheets are ideal for use as subpads or cushioning layers beneath polishing pads.

Key Features:

• ✅ Excellent Compressibility & Resilience
  Provides uniform pressure distribution and consistent surface contact during wafer polishing.

• ✅ Fine Cell Structure
  Ensures low surface defects and stable polishing performance.

• ✅ Chemical Resistance
  Withstands CMP slurries and cleaning agents, maintaining long-term durability.

• ✅ Dimensional Stability
  Maintains flatness and thickness uniformity under thermal and mechanical stress.

• ✅ Customizable Hardness & Thickness
  Tailored to meet specific equipment and process needs.

Typical Applications:

• Subpad for wafer CMP polishing systems

• Cushion layer for LCD glass or optical lens polishing

• Buffer layer in multi-layer CMP pad constructions

Available in various densities, thicknesses, and hardness levels, our TPU foam sheets deliver consistent, high-precision performance for advanced semiconductor fabrication.